A flex-rigid wiring board (10) comprises a rigid printed wiring board (11, 12) and a flexible printed wiring board (13) including a flexible substrate.
The attached USB-C cabling runs roughly 13” long.
Disclosed are a cabling rack and a cabling device.
The insert bracket helps to retain cabling within the wall bracket when the trim bracket is removed or to keep cabling running along the bracket system separated.
In one embodiment, the cabling media includes four twisted wire pairs, with each twisted wire pair having its twist length purposefully varying along the length of the cabling media.
A cost comparison of copper cabling and fiber optic cabling must include both short-term and long-term costs.
The first wiring and the second wiring extend along the gate wiring.
By using a conductive layer including Cu as a long lead wiring, an increase in wiring resistance is suppressed.
The write wiring (31) is provided with a plurality of wiring parts (31c, 31d) along one plane (41a) of the TMR element (4a), and a plurality of wiring parts (31e, 31f) along the one plane (41a) of the TMR element (4b).
The flexible wiring member (102) positioned on the outside when wound is increased in length than the flexible wiring member (101) positioned on the inside.
Each hinge has a head wiring channel disposed to form a continuous wiring channel along the hinge apparatus.
The wiring comprises a first wiring section and a second wiring section.
The first wiring is disposed between the gate wiring and the second wiring.
The first wiring is separated from the third wiring.
The multi-pattern wiring substrate can be split with less blurring and chipping when separating the multi-pattern wiring substrate into wiring substrates along splitting grooves.
The first wiring is the wiring closest to the gate wiring.
The power supply wiring posts are fixed with the wiring board via the wiring holes.
Conventionally, reinforcing wiring patterns (wiring dummy patterns) have been formed only in wiring layers.
The wiring module consists of a random wiring module (52) and a cross wiring module (56).
The upper surface wiring lines include wiring lines that are electrically connected with the first wiring lines via the second wiring lines.
Wiring comprises an upper wiring layer, a lower wiring layer, and an insulating film.
This wire harness is equipped with an electric-wire bundle, a long object, and a covering member.
The first electrode has a first wiring formed on the insulating film and a second wiring formed on the first wiring.
The grid-like quadrangular electrical main wiring has the advantages of both the quadrangular wiring and 3/2 wiring.
A printed wiring board having the wiring member is also provided.
Weight can be reduced while ensuring an identical field of view as compared with a case where the electrodes are taken out from more than one side and wiring can be facilitated while shortening the wiring length.
The inside wiring section (40) includes a first wiring layer (42), a second wiring layer (43), and a connection section (44) that connects the first wiring layer (42) and the second wiring layer (43).
There is a commercial wiring system and method for wiring, which is designed to increase the speed of installation of wiring devices.
The wiring substrate portion (2) further has a first wiring substrate (20) and a second wiring substrate (25).
A wiring to be checked and at least one influential wiring are selected from chip wirings including the internal wiring.
The wiring may be a building utility wiring, such as telephone, AC power or CATV wiring.
The optical semiconductor is linearly arranged along the longitudinal direction of the flexible wiring substrate.
A wiring layer is formed by lower layer wiring (40) and upper layer wiring (41) formed on an insulating layer which covers the lower layer wiring (40).
The outside wiring section (41) includes a third wiring layer (45).
Each auxiliary wiring (9(m)) is formed above the corresponding one of the wirings (7(m)).
The capacitor (C) is connected between the wiring (21) and a wiring (22).
A wiring pattern (63) is formed on the wiring plate (60).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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