In a step (S7), in the case (S5:YES) wherein the failure chip is contained in the mounting substrate, the failure chip is rejected by cutting the wiring of the failure chip.

When a driver IC chip is mounted on this laminate, the wiring of the driver IC chip can be recognized through the insulating layer.

To enable forming the stacked chip assembly, trenches are laser micro-machined onto the bottom surface of a chip to accommodate the bond wedge/ball and wire path of the chip beneath it.

Therefore, the arrangement positions of each of the connecting pads (110, 116) are at a shortest distance, and wiring arranged on the wiring chip (102) is shortened.