The lead frame includes a chip carrier and a plurality of leads surrounding the chip carrier and arranged in multiple rings.
The lead frame (201) includes a chip carrier (202) and a plurality of leads (203) surrounding the chip carrier (202) and arranged in multiple rings.
The lead frame includes a chip carrier and a lead.
The lead bonding IC chip is provided on the chip carrier.
Disclosed is a flip chip on chip package and manufacturing method.
In one embodiment, a chip package (300) includes: an encapsulation (110) having a top surface and a bottom surface facing away from the top surface.
The image or light sensor chip package also includes wirebonded wires or a flexible substrate bonded with the metal structures of the image or light sensor chip.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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