Provided is a solder ball that suppresses interfacial peeling at the bonding interface of the solder ball and suppresses non-fusion that occurs between the solder ball and a solder paste.
Then, the height of the solder ball is obtained by adding the height of the center to the radius of the solder ball.
Also disclosed is a solder ball obtained by spheroidizing the solder alloy.
There is disclosed a solder ball filling apparatus.
The wafer-level CSP has a plurality of solder ball pads (206), a solder ball (308) at each solder ball pad and a polymer collar (310) around each solder ball.
The solder ball and the columnar electrode form a structure similar to a bolt; thus the binding force between the solder ball and the columnar electrode is improved.
The solder ball is soldered to the circuit board with a lead-free joiner solder.
Also provided is an electronic member having the same.
A lead-free solder ball is soldered to the module without using a joining solder to effectuate the soldering.
A solder ball (100) closes the void without completely filling it.
The electronic member uses this solder ball for semiconductor mounting.
In some implementations, the bonding component is one of a solder ball.
The conductive terminal forms a mounting portion connecting with the solder ball.
The conductive terminal forms a mounting portion connecting with the solder ball.
The solder ball side of the part is then grit blasted with an abrasive material.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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