The invention is useful for incorporating or replacing balls in substrates of electronic components.
A drop ball mechanism with a fluid by-pass is described for disengaging the milling elements.
Another advantage is that resistance to fretting is significantly improved to the extent that the greases containing these components are capable of achieving a high level of resistance to false brinelling.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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