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électronique et électrotechnique - acta.es
Advanced silicon microstructuring by electrochemical micromachining: technology and applications... Among the main features of ECM there are: i) high aspect-ratio (HAR) of feasible structures, and in turn, high integration density; ii) fine control of etching anisotropy (from 0 to 1), and in turn, enhanced flexibility in fabrication; iii) reduced roughness (about 20 nm) of etched surface.This...
général - core.ac.uk - PDF: core.ac.uk
Surface morphology of p-type (100) silicon etched in aqueous alkaline solution... The addition of ferricyanide does not markedly change the etching anisotropy....
In-plane si nanowire growth mechanism in absence ofexternal si flux... The dropletshape is determined by the Si etching anisotropy....
Anisotropic etching of deep trench for silicon monolithic microwave integrated-circuit... Under optimal processing conditions, an etching anisotropy of 0.98...

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