The alloy plating layer is preferably made of a nickel-cobalt alloy, a nickel-cobalt-iron alloy, a nickel-manganese alloy, a nickel-phosphorus alloy , or a nickel-bismuth alloy.
of synthetic diamonds which are agglomerated with a metal alloy, ceramic alloy or plastic alloy
of synthetic diamonds which are agglomerated with a metal alloy, ceramic alloy or plastic alloy
The usable solder alloys include Ag alloy and Ag-Cu alloy.
The adhesion layer includes one of Cr, Cr alloy, Ti, Ti alloy, Mo, Mo alloy, Ta, Ta alloy, the Ag containing layer includes Ag or Ag alloy, and the protection layer includes one of IZO, Mo, Mo alloy, Cr and Cr alloy.
Suitable alloy materials for use in such an anti-diffusion film (15) include WTi, and particularly WTiN.
The invention further relates to an alloy obtained by said method and to prostheses produced from such an alloy.
The body of material is formed from tungsten-molybdenum alloy or a molybdenum-rhenium alloy or a tungsten-rhenium alloy or a tungsten-molybdenum-rhenium alloy.
The term 'iron aluminide alloy' means alloy base on Fe3Al.
The bottom layer (6a) of the second electrode film (6) is formed from one metal selected from the group consisting of AlCu alloy, NiCr alloy, AlSi alloy, AlTi alloy, titanium, and copper.
loss of alloying elements during deposition
loss of alloying elements during deposition
The invention relates to a flexible aluminium alloy which can be obtained by alloying aluminium with carbon graphite, said carbon graphite having been polymerised twice.
The first magnetic layer (60) contains a TM alloy, the second magnetic layer (40) contains a TM alloy or a RE-TM alloy, and the third magnetic layer (20) contains a RE-TM alloy.
The material is particularly a magnesium alloy or an iron alloy.
The alloy plating preferably includes a nickel-cobalt alloy, nickel-cobalt iron alloy, nickel-manganese alloy, nickel-phosphorous-alloy or nickel-bismuth alloy.
A Cu-Mn alloy or a Cu-Ni alloy is used as the second metal.
The first intermediate layer contains a first alloy and a second alloy, while the first light-blocking conductive layer contains the second alloy.
The material of the cathode is scythe-silver alloy or ytterbium-silver alloy.
The catalictically-active metal alloy comprises a silver-containing metal alloy and may comprise an alloy having silver and copper as the principle constituents.
A second alloy is poured into the mold atop the first alloy and solidified.
The heating element (7) is made of a nickel alloy plated with gold or the gold alloy.
The alloy may comprise a hydrogenated silicon alloy or a hydrogenated silicon- germanium alloy.
The material of substrate is a Ti- alloy or Ni- alloy or steel.
Preferably the body is of an aluminium alloy, for example one that is superplastically deformable.
Said alloy is a Ni base alloy that consists of the following:(table) The invention also relates to a method of manufacturing the final spacer grid according to the invention.
A magnesium alloy member material using a magnesium alloy in a solid-liquid coexistence, and production methods for the magnesium alloy member material and a magnesium alloy member.
The base alloy may include a nickel titanium alloy (NiTi), a copper chromium nickel titanium alloy (CuCrNiTi), or a copper aluminum nickel (CuAINi) alloy.
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