The polishing grains are made of a chemically resistant material.

The invention relates to a device for heating a liquid or semiliquid medium, especially a polishing agent for chemical mechanical polishing.

An improved polishing composition is provided that includes an emulsion of oil-based components and water-based components and a water soluble polishing agent.

Additionally, a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample is disclosed.

It is constituted so that microcapsules, in which a polishing agent is encapsulated, are dispersed in a water/oil repellent agent.

A polishing agent (130) coats an interior surface (135) of the concave cells.

The method generally includes mechanical polishing of the diamond film (55) against a ceramic surface (64) in the presence of a treating agent of potassium nitrate and a polishing agent of potassium hydroxide.

A polishing agent (246) coats an interior surface (248) of the concave cells.

A polishing agent is applied in the region between the shaft and the roller bearing.

Disclosed is a high-purity cerium polishing agent having a high cerium oxide content, which is improved in polishing rate.

According to the process, foreign particles are less susceptible to remaining on a glass substrate in polishing the principal surface of the glass substrate with a polishing fluid that contains a zirconia-containing polishing agent.

In the first embodiment, the process comprises applying a pitch to a lap tool (10) and forming channels in the pitch.

The invention also relates to the use of a polishing agent to planish a semiconductor substrate.

The invention relates to the use of a silica-based polishing agent for polishing an optical glass.

In this polishing agent, an amino acid is preferable as the organic acid, hydrogen peroxide is preferable as the oxidizing agent, and a tetrazole derivative is preferable as the anticorrosive agent.