Provided is a method for forming a narrow-pitch flip-chip bonding electrode and a wire bonding electrode at the same time so as to reduce cost of a substrate.

A connecting conductor (471) is connected to each sensor electrode (261), said conductor extending from the respective sensor electrode (261) to the lowered lower region (280).

Subsequent to the above series of steps, the formation of the glass layer is followed by the formation of a plurality of plating layers on a silver electrode on the bottom of the openings of the glass layer to form an electrode for bonding.