The through substrate via may include a substantially constant diameter through a length of the through substrate via.

There are also flush thermal vias (314).

The first, lower board is formed with a plurality of through-holes and pins extending respectively through these through-holes, some of the pins being positioning pins.

The thermal vias may have one or two flanges (118).

Application: metallization of through-vias, especially for 3‑D integrated circuits.

Vias that connect inner and outer layers are known as blind vias.

The non-electrically conductive substrate (40) has three through-holes formed through a thickness of the non-electrically conductive substrate (40).

The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias (44a, 46a, 45a).

You’ll have to use vias, and traditional vias can cause reflection and interference.

The through substrate via may be filled with a conductive filler material.

The substrate has conductive vias provided between isolated conductive layers.

The protection layer ( 114) comprises built-in arrays of porous vias (116).

HDI - High density interconnect boards are the most dense and use special techniques like blind, buried, and micro vias to save space.

HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter.

HDI PCBs contain blind and/or buried vias and often contain microvias of .006 or less in diameter.