The hole may be a blind hole or a through hole.
A master hole may be a hole location master, hole depth master
The second alignment hole opposes the first alignment hole.
The first through hole (102) and the second through hole (201) form an integral through hole (400).
The first hole and the fourth hole have a corresponding first orientation and the second hole and the third hole have a corresponding second orientation.
The hunting-prevention hole (4) is positioned between the discharge hole (2A) and the back-pressure-relief hole (3).
This invention generally relates to enlarging a hole in a substrate such that the enlarged hole is centered on the existing hole.
An air vent hole communicating with the outside is provided in the press-fitting hole.
Thus, variation of the hole shape of the through hole (25) is prevented.
Furthermore, the invention relates to a downhole operation method for operating the downhole driving tool of the downhole system.
The first perforations (12) and the second perforations (22) corresponding to the first perforations align to form passages.
A method and apparatus for wellbore perforation in which a laser beam at a downhole location of a wellbore is directed to a target area of a wellbore wall to be perforated.
The housing defines a first bore and a second bore in communication with the first bore, and rotor is disposed within the second bore.
The intermediate bore portion (48) is arranged between the first bore portion (44) and the second bore portion (52).
In either position, equipment may pass into the primary borehole downhole of the primary/lateral junction.
The dump valve comprises a body (202) having a control bore (204), an opposing pilot bore (208), an exhaust bore (254) intersecting the control bore (204), and a connection bore (236) intersecting the control bore (204).
The bore hole is formed on the axis and includes a first bore with a first diameter, a receiving surface, and a second bore.
The nozzle unit injects the high-pressure water to cut a rock around the hole so that the hole communicates with a neighboring hole.
The through hole conductor is formed within the through hole.
The nozzle insertion hole leads to the tip receiving hole.
The via (240) comprises the hole and the first metal.
The auxiliary hole may be a through hole or a blind hole.
The first through hole (1) is arranged below the through hole.
Upon identification of a coverage hole, action may be taken to mitigate (e.g., reduce or eliminate) the coverage hole and/or avoid the coverage hole.
The access and lock mounting holes are co-axial.
The mounting hole is provided with a through-hole pierced in a height direction of the socket body and a contact support hole of the contact.
The M6 screwed hole is matched with a mounting hole of the ten-folding sectional material.
The mounting plate (1) has a plurality of mounting hole (21) patterns and a shaft hole (19).
The mounting hole includes a center hole (921) and multiple narrow and long restricting holes (925).
The via (341) is provided in proximity to the via (323), and the via (342) is provided in proximity to the via (333).
The via may include a through substrate via.
The same is true for the injection direction of injection hole (611A), injection hole (611B), and injection hole (611F).
The first hole and the second hole are not connected to each other, and the first hole is disposed at a position separated from the second hole.
The female component has a coupling hole (220) disposed therethrough, the coupling hole including a first hole (222) and a smaller second hole (224) connected to the first hole.
The same is true for the injection direction for injection hole (611C), injection hole (611D), and injection hole (611G).
The bracket plate has a through hole (32), and is provided in the central hole in such a way that the through hole is concentric with the central hole, and can rotate around a central axis of the central hole.
A membrane (8) is arranged in said hole (7) transverse to the hole axis (E) thus forming a first hole space (a) and a second hole space (b).
A method for producing a printed circuit board (10) is described A substrate (12) having a via (16) is provided with the via being coated with a conductive layer defining a perimeter of the via.
The inner casing is provided with a second penetrating hole and a through hole.
The via is then plated with metal to substantially close the smaller hols.
When viewed from the direction of extension of the nozzle insertion hole, the nozzle insertion hole encloses the tip receiving hole.
The downhole tool has a downhole flowline for receiving the downhole fluid.
The through hole (S) penetrates the fiber layer (9), and the through hole conductor is formed in the through hole.
A sound hole on the microphone communicates with the first through hole.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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