A respective slice address is generated for each remaining slice (3-5) to enable identification of the slice start position within the picture (1) for the slice.
Each assembly comprises a sealing slice that is fixed to a base slice.
Then a plurality of second OCT slice images (46), each second slice image representing a different slice of the object (12), are recorded.
In one embodiment, the second slice is isolated from the first slice.
Each pre-assembly comprises a base slice, a sealing slice and a fixing layer provided between the base slice and the sealing slice.
second loss tranche or better
Benefit of Individual Tranche = (market price of the tranche – Fee) * Total EUR amount of tranche * maturity of the tranche (weighted average life
tranche of PLN 7 million) and 29.12.2006 (2nd tranche of PLN 13 million
July 2005 (1st tranche of PLN 12 million) and August 2005 (2nd tranche of PLN 8 million
Second tranche of USD 700 million
Disclosed is a wafer detecting apparatus which can accurately detect a wafer storage state.
The wafer stack (100) comprises a first wafer (OW1) referred to as optics wafer and a second wafer (SW) referred to as spacer wafer, said optics wafer (OW1) having manufacturing irregularities.
A wafer stage system drives a wafer stage (WST), which holds a wafer (W) through a wafer holder (25) along a wafer base (BS).
The LED wafer and a carrier wafer are joined.
The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer.
The LED wafer is bonded to a carrier wafer.
Retrieval is made for each hour band.
Arable area (AA) percentage band
Annual Work Unit (AWU) percentage band 2
This ratio shall be expressed as a percentage band.
Their importance shall be expressed as a percentage band.
the remainder of the first instalment shall be carried over to the second instalment
Member States shall check that each instalment of the advance has actually been spent, before paying the following instalment.
Member States shall check that each instalment of the advance has actually been spent, before paying the following instalment.
Subtotal: remuneration for 1st instalment (DEM
instalment due during a financial year
fat of the inside of topside
without fat on the inside of topside
without fat on the inside of topside
without fat on the inside of topside
Single age bracket or first age bracket only
Single age bracket or first age bracket
Single age bracket or first age bracket
Single age bracket or first age bracket
Single age bracket or first bracket only
In the testing wafer unit, the connecting wafer has a shape corresponding to the wafer to be tested.
In a slot or sub-slot, communication units (101) may utilize the communication resource according to a specific set of access methods defined for that slot or sub-slot.
The wafer level package structure is composed of a semiconductor wafer whereupon a plurality of sensor units are formed, and a package wafer bonded on the surface of the sensor wafer.
available capacity of a thermal unit
The package structure includes a semiconductor wafer having a plurality of sensor units, and a package wafer bonded on the semiconductor wafer.
Each slot in the frame is comprised of a first slot duration and a second slot duration.
The emitter is disposed between the first wafer and the second wafer.
A wafer receptacle (2) holds the bonded wafer (28) to be measured securely in place.
The composite wafer can help avoid wafer bow.
An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system.
A method includes attaching a partially processed CMOS wafer to a second wafer to produce a combined wafer.
An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed.
A device wafer is then bonded to the handle wafer.
The seal rings bond the device wafer to the second wafer.
After wafer processing, the sequence is reversed to return the wafer (35) to the horizontal wafer handler (11).
A wafer table (31) is provided for sucking a wafer (20).
The wafer polishing apparatus uses the roller to polish the wafer.
The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure.
In a transmit mode, the ECIM (30) reading data 32 bits at a time from the ECCS (14) and loading the data into the CMM (32), the UIM (34) unload the data from the CMM in 16 bits at a time and transferring the data to the SONET framer (16).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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