Further, the firing can be conducted at a temperature lower than the conventional firing temperature.
The thick-film fuse element is coated with an overcoating composed of an insulation resin material having a firing temperature lower than the firing temperature of the metal resinate.
Only one firing step is needed with a low peak firing temperature of about 700°C to about 1000°C. The method conserves energy and natural resources compared to clay-based traditional ceramic manufacturing.
By the addition of finely milled glass, as a fluxing agent, the firing temperature has been reduced.
The melting point of the metal beads is higher than the firing temperature of the paste.
The encapsulating layer has a specific melting temperature and a specific curing temperature; the melting temperature is lower than the curing temperature.
Theresin composition forms a cured resin when exposed to a curing a gent and heated to a curing temperature that is relatively close to ambient temperature.
The viscosity of the resin component changes from a high viscosity state to a low viscosity state when the temperature is increased from ambient temperature to the curing temperature.
Said lacquers have a low baking temperature and preferably find application in the lacquering of plastic pieces.
A cooking temperature alarm device for a cooking-device handle, alarming by sound when an object being heated in a cooking device reaches a preset temperature.
The wafer (205) is then baked at the bake temperature for the bake time.
A heating element (44) for providing the cooking temperature is provided in the cooking chamber, and is movable to a plurality of positions within the cooking chamber.
Low temperature cooking is defined as any cooking procedure where the cooking temperature is at, or close, to the desired final internal temperature.
The characteristics of this signal are a function of the sensed cooking temperature.
The method includes a heat up procedure that involves running two or more heat up cycles to stabilize the cooking compartment to a cook temperature.
The controller is comprised of a temperature sensor input for receiving an output of a temperature sensor and a system for initiating the cooking of a food product based upon a set cook temperature and a set cooking time.
By reducing/lowering the burning temperature, NOx formation is also reduced
Lower the baking temperature, and/or respect the baking time.
The vaporization or evaporation temperature of the conducting substance in question is below the burn-in temperature of the powder coating.
Based on the first thickness and first FTIR spectra, a bake time and bake temperature is determined.
A cooking application (10) is provided having an adaptive control system (50) to control the cooking temperature of a food product.
Also, the cook temperature for the process is preferably maintained at or below a maximum of about 126oC.
A lower initial cooking temperature is obtained in the cooking zone, which ensures that the exothermic cooking process does not lead to the attainment of temperatures detrimental to the pulp quality.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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