The invention also relates to methods for producing light emitting diodes of this type using a thin-film technique and to light-emitting-diode components comprising light-emitting-diode chips of this type.
The invention relates to a thin-film assembly (1) comprising a substrate (2) and at least one electronic thin-film component (8) that has been applied to the substrate using thin-film technology.
The additional layer (3, 5, 6, 7) can be made of a material that can be structured according to thin-layer technology or thick-layer technology.
A thermogenerator (5) comprises n and p thermoelements (1, 2) applied to a substrate by thin and thick-film technology.
An example of damage analysis demonstrates how useful a FIB can be to surface scientists.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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