The package comprises a laminate substrate (10), wherein the electronic chip (30) is attached on the laminate substrate (10).

The inductor within the laminated substrate is formed by embedding the magnetic core (1) within the laminated substrate.

A decorative laminate includes a laminate substrate coated with an adhesive layer.

A cellular core structure is interposed between the first laminate substrate and the second laminate substrate and fixedly coupled to the first laminate substrate and the second laminate substrate.

A laminate window frame (150), which may be a part of the bottom laminate substrate, is fabricated along a periphery of the bottom laminate substrate to form a center cavity (160).

In one embodiment, a hybrid fiberglass composite structure includes a first laminate substrate and a second opposing laminate substrate.

The center cavity enclosed by the bottom laminate substrate, the laminate window frame and the top substrate houses the top die affixed back-to- back to a bottom die (134) that is affixed to the bottom laminate substrate.

Disclosed is a transparent conductive film-laminated substrate.

At least one of the first laminate substrate and the second laminate substrate includes at least one polymer fiber layer and at least one glass fiber layer.

The flexible glass substrate and the laminate substrate are brought together, with an adhesive therebetween, thereby creating an adhesive bond and an electrostatic bond between the flexible glass substrate and the laminate substrate.

A method of forming a via in a laminated substrate by forming ablated material by laser drilling a via in a laminated substrate.

A method of forming a via in a laminated substrate by applying a polymeric photoabsorptive layer on an exposed surface of a laminated substrate.

Disclosed is a metal laminated substrate for epitaxially grown film formation for semiconductor element formation, the metal laminated substrate comprising a metal substrate having a high biaxially crystal-aligned surface.

The power amplifier (12) is mounted on the laminated substrate (11).

A ceramic block (6) is furnished on the laminated ceramic substrate (1).