The features are transferred into an underlying substrate (12).
The underlying substrate (25) is a solid color.
The patterned substrate is developed then etched, where the etching transfers the pattern from the photoresist coating to the underlying substrate.
The groove is then etched further until it extends into the underlying substrate.
As a result of the removal of the underlying substrate material, magnetic and capacitive coupling of the inductor to the substrate may be reduced.
The array substrate comprises an underlaying substrate (1) and multiple dual-gate thin-film transistors located on the underlaying substrate (1).
This heating may result in improved adherence of a coating system to the underlyling substrate.
The temporary coatings and films will not adversely chemically alter the surface of the underlying substrate.
A soft elastomeric disc for removal of polymeric compositions from an underlying substrate.
The intermediate layer is formed over an underlying substrate and over a dielectric layer formed over portions of the substrate.
In length, the moveable composite comprises a fixed portion attached to the underlying substrate and a distal portion moveable with respect to the substrate electrode.
The cantilevered flap is released from the underlying substrate by etching out an underlying sacrificial layer disposed between the flap and the substrate (22).
The determined coating weight is insensitive to changes in the amount of substrate material underlying the coating.
The combined pattern, having features of difference sizes, is then transferred to the underlying substrate (110).
The transition region acts to change the structure from the underlying substrate to that of the bulk crystal.
Applying a voltage between the substrate electrode and moveable composite electrode creates an electrostatic force that attracts the moveable composite to the underlying substrate.
According to one embodiment, a wire is spaced apart from an underlying substrate, and the wire extends between a first end and an opposing second end, each of the first and second ends being affixed to the substrate.
An Ormosil composite coating that provides good corrosion and abrasion resistance of the underlying substrate.
A small via hole is produced in the insulating layer to leave a portion of the underlying substrate uncovered.
Use of the resulting product in the photoresist of a lithographic printing plate improves its adhesion to an underlying substrate.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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