The wire (14) is then bonded to the second pad (18) using thermocompression bonding.
A method to fabricate the RFID board via thermocompression bonding is also provided herewith.
A thermocouple (5) for temperature detection is installed in the vicinity of the thermocompression bonding portion (2).
A cut (3) is provided in the body, from the base end side toward the vicinity of the thermocompression bonding portion.
A heater chip for thermocompression bonding, where the degree of heating at a thermocompression bonding part does not vary among individual heater chips and durability is enhanced.
The leads are joined to the leadframe (104) by an interference fit, convention bonding technique (such as solder or thermal compression bonding), or other technique.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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