Low-melting waxes (indium, lead-tin solder, tin-zinc solder, etc.) can be automatically and uniformly applied to work of large area, such as sputtering targets.

The tin-zinc solder, however, poses problems, such as a strong susceptibility to oxidation, a very poor wettability and occurrence of large number of voids.

In this table, a 50-50 tin/lead solder is used because it is the weakest of all the common copper joining methods.

At least part of the second metal region is in contact with the first metal region, and the tin-bismuth solder particles are surrounded by and scattered in the resin part.

The solder layer (8) comprises at least one kind selected from the group consisting of gold-tin alloys, silver-tin alloys and lead-tin alloys.

Low-melting waxes (indium, lead-tin solder, tin-zinc solder, etc.) can be automatically and uniformly applied to work of large area, such as sputtering targets.

A low temperature solder is preferably a lead-tin based solder having a melting point below that of eutectic lead-tin solder.

the presence of lead-tin solder (wire thickness 34 mm);

This type of solder is usually made up of a Tin/Copper alloy.

The solder should be 60/40 tin/lead (or 63/37 tin lead).

The invention is directed to an electroplating apparatus for selectively depositing tin/lead solder bumps at a high deposition rate.

The solder ball comprises a tin-antimony alloy that includes about 3 % to about 15 % antimony by weight.

Provided is an electrochemical device that is compatible with high temperature reflow soldering using lead‑free solder.

It is very important to cover the tip of the stinger with solder (tin).

80 Tin and articles thereof