The semiconductor material can be an n-type semiconductor.
The p-type semiconductor is in contact with the n-type semiconductor.
The second slab portion has a second N-type semiconductor and an N-type conductor that are connected to each other, the second N-type semiconductor being connected to the first N-type semiconductor of the rib portion.
The semiconductor device comprises an N-type semiconductor substrate, a P-type layer formed in one side of the semiconductor substrate, an N+ layer formed in the other side, and a buffer layer formed near the N+ layer.
The N-type semiconductor element is particularly suitable for being used to manufacture a refrigeration or heating device of a semiconductor.
The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material.
A type of semiconductor where electrons are the majority charge carriers.
Further, it is desirable that the electron-emitting surface of the cathode is composed of an n-type or p-type diamond semiconductor.
The NOR-type nonvolatile semiconductor memory includes an island-shaped semiconductor layer formed on a semiconductor substrate.
The electron extraction layer (3) includes an n-type semiconductor, and the thickness of the electron extraction layer (3) is 0.1-15 nm.
The emitter region is formed of an n-type semiconductor, is in contact with the insulating film, and is in ohmic contact with the emitter electrode.
In order to manufacture an intermediate-band solar cell, it is necessary to connect the intermediate band material (1) with an n-type semiconductor (2) and another p-type semiconductor (3), which will act as emitters.
The transparent electrode layer has a high impurity concentration toward the transparent substrate and a low impurity concentration toward the n-type compound semiconductor layer.
In a n-type semiconductor the last band occupied by the electrons supplied with an impurity (donor) is the conduction band.
The substrate is electrochemically etched with a low current during illumination to form at least one sample reservoir, each sample reservoir being formed at a respective lit region on the n-type semiconductor substrate.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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