At least one contact section (B) is formed for electrically connecting the second wiring pattern (17) and the first wiring pattern (16) by having the second wiring pattern over the first wiring pattern.

The second wiring pattern is disposed such that the grounded end of the second wiring pattern is disposed adjacent to the connection end or the open end of the first wiring pattern.

The top and bottom surfaces of the insulating film have a top wiring pattern layer and a bottom wiring pattern layer, respectively.

An inter-substrate connection chip part is used for connection between wiring substrates having a wiring pattern.

The printed wiring board further includes a second wiring pattern having a grounded end and an open end and extending in a direction in which the first wiring pattern extends.

The flexible substrate (22) is provided with anode reinforcement wiring (27) and cathode reinforcement wiring (28), which are electrically parallel to the wiring pattern.

The aim of the invention is to simplify the field cabling and the regulation design.

A connection scheme for a Programmable Logic Controller is taught.

The interposer substrate (3) has a wiring pattern (6) inside.

A wiring pattern circuit includes part of wiring between a module control circuit and a module.

An equivalent circuit diagram is then synthesised (5) for each of the broken-rational functions.

The equivalent circuit diagrams of the branch impedances are finally assembled into a high-frequency equivalent circuit diagram of the electronic component (6).

On the printed wiring substrate (2), wiring to a land (32a) formed on the connection surface is performed by using the wiring pattern (32) of the inner layer side.

Here is the Channels stanza after adding the MQIBindType value.

Here is my old computer after removing the HDD module.