The disclosed epoxy resin composition contains an epoxy resin and an epoxy resin hardener, said epoxy resin being a triepoxyethylmicrohexane epoxy resin represented by formula (1).
The epoxy resin should be a single-liquid epoxy resin.
The epoxy resin is Bisphenol A epoxy resin.
The epoxy resin includes an epoxy resin of Chemical Formula.
The epoxy resin includes an epoxy resin of Chemical Formula.
Said form material is a silicone, an epoxide or a silicone-epoxide hybrid material.
The present invention is directed to a process for manufacturing of an epoxide resin, an epoxide resin obtained by this method as well as the use of said epoxide resin.
A resin composition, in particular for a casting resin, contains an epoxide-isocyanate resin and a metallic filler.
Such epoxide resin systems and epoxide resin moulding materials produced therefrom have a greater resistance to yellowing.
The powder coating composition contains a solid epoxy resin which has an average epoxide functionality per molecule of greater than 2 and a solid curing agent for the epoxy resin.
A solid thermally expansible material is provided.
A method for producing the epoxy resin, an epoxy resin composition containing the epoxy resin as an essential component, and a cured product containing the epoxy resin as an essential component are also disclosed.
The epoxy resin composition contains the styrene-modified polyhydric hydroxy resin or epoxy resin as an essential component.
Further, the epoxy resin composition comprises the epoxy resin and a curing agent as the essential components.
Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B).
Process for hydrolyzing an epoxy resin by reacting said epoxy resin with water in the presence of a catalyst.
Disclosed is a resin composition containing an epoxy resin containing a naphthalene-modified epoxy resin and a triazine-modified novolac resin.
Disclosed is an epoxy resin molding material for sealing which contains an epoxy resin, an epoxy resin curing agent, and a pitch.
Also provided are an epoxy resin composition comprising the phosphorus-containing epoxy resin obtained by said production method, and a cured product of the epoxy resin composition.
These resulting porous materials can include, but is not limited to short fiber reinforced epoxy or epoxy.
Non-exposed epoxy is developed away to leave a pattern of cured epoxy at each level.
The heat-curing resin composition contains: an acrylic copolymer containing a (meth) acrylic acid ester monomer that contains an epoxy group; an epoxy resin, and a curing agent for the epoxy resin.
Preferably the material comprises a phenolic resin or an epoxy resin.
The acenaphthylene modified phenolic resin is useful as a curing agent for an epoxy resin intermediate and an epoxy resin.
Optionally, the epoxy resin can be acrylated.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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