The process is applicable to flip-chip interconnection in certain particular photoelectric chips, MEMS chips and biodetection chips.

At the same time, a chip slicer provides direct sliced chips from the chip estimates.

The LED chips are frameless LED chips.

A multiple-chip module comprising a plurality of semiconductor chips such as bare chips and packaged chips mounted on a circuit board.

This chip supply apparatus supplies chips to a mounting apparatus that mounts the chips on substrates.

Each array of dice is arranged in face-to-face relation to the other array of dice, thus forming a lower layer (110) of dice and an upper layer (120) of dice.

Furthermore, the electrode kit includes a substrate with a heat sink buried in the back side of the substrate and chip binding regions arranged on the front side of the substrate, and the chips (3) are fixed in the chip binding regions.

In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested.

He said, “Whatever you want, guns, knives, brass knuckles.

The invention also provides intermediate chip products and final chip products of the method.

one or more light emitting diode chips either chips manufactured using thin-film technology or so-called sapphire emitter chips and

The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC chip package, and a local oscillator (LO) multiplier MMIC chip package.

The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments.

The memory chips used are preferably NAND Flash EPROM memory chips.

The Zener diode chips (Z) are individually connected inversely in parallel with the individual ones of the LED chips (31).