The bridge chip is positioned so that a free end is proximate to a neighboring chip, thereby supporting proximity communication between the base chip and the neighboring chip.

A second die, having a significantly smaller footprint, is mounted upon the surface of the first die, on a second die attach region toward one edge of the first die.

Since viscous die attach material is not deposited on the lower die, die attach material does not flow onto the bonding pads of the lower die.

The at least one chip is encased in at least one envelope surrounding the chip, with the envelope extending from a first position below the position of the at least one chip to a second position above the chip position.

The system includes a virtual smart card server, storage connected to the virtual smart card server, and a virtual smart card agent connected to the virtual smart card server.

The die comprises an interface configured to receive a transaction from the further die via an interconnect and for transmitting a response to the further die via the interconnect.

For given data and control channels, a transition (θ1) from a first chip to a second chip and a transition (θ2) from a third chip to a fourth chip are determined for all possible combinations of channelizations.

The die has an interface configured to receive a transaction from the further die via an interconnect and to transmit a response to said transaction to said further die via the interconnect.