The bonding pad has a bonding pad surface and a bonding pad edge.

A non-contact power supply pad is provided with a power-receiving side pad (111), a power-transmitting side pad (110), and an auxiliary pad (112).

First interface circuit is electrically coupled to the first pad and the third pad, while second interface circuit is electrically coupled to the second pad and the fourth pad.

A second auxiliary test pad (60) is adjacent to the primary bonding pad (58).

The solder ball pad also has an anchor pad (201) coupled to the bonding pad and extending between the substrate and the solder mask.

The heat transfer pad, retention pad, and hole are in thermal communication with each other.

The external terminal is electrically connected to the pad with the conductive paste applied on the pad.

The heat transfer pad and retention pad are disposed adjacent to the hole and the retention pad has a thermally activated conductive material positioned thereon.

An optoelectronic component with two electrical contacts is mounted on a first contact pad with one contact connected to the pad and a second contact connected to a second pad.

According to various embodiments, the electrical connectors include a low-profile conductive stud, a low-profile sheath that surrounds the stud, and a socket to mate with the stud.

The first semiconductor chip has a first gate electrode pad, and a second gate electrode pad electrically connected to the first gate electrode pad.

The moat isolates the pad area and the conductive material beneath the pad area.

Each of the wire bonds couples the second pad of one trace to the first pad of another trace.

A terminal extends from the terminal end and is configured in electrical communication with the electrode.

The plug supporting means is provided with incorrect connection prevention mechanisms (68, 69a-69d, 77) for preventing connection of a plug other than a specific plug.