Accordingly, reverse bias testing may be facilitated by providing a second ground pad, separate from the die ground pad, specific to the VCSEL.

A coaxial connecting device electrically connects a coaxial cable to a signal pad and a ground pad.

A ground pin projects outwardly from the bottom surface of the center ground pad and outwardly from the bottom surface of the base housing.

This increase occurs along either a transition or contact portion of the ground terminal.

The width of the ground terminal (150) increases along its extent with respect to the signal terminals (140, 141).

An integrated circuit (51) comprises a power distribution network having a power pad (53) and a ground pad (55) arranged at diagonally opposite corners of the integrated circuit (51).

A plurality of decoupling cells (65) are provided on the power distribution network for maintaining a static current flow between the power pad (53) and the ground pad (55).

A center ground pad, having a top surface and a bottom surface, is provided within the base housing.

The ground conductor has a bottom surface that is in rotatable contact with the top surface of the center ground pad in the base housing, and a top surface that projects outwardly from the top housing.

A termination structure for mating a cable connector to a circuit board has a ground terminal (150) and two signal terminals (140, 141) arranged in triangular pattern through the connector in order to reduce the impedance through the connector.

Accordingly, reverse bias testing may be facilitated by providing a second ground pad, separate from the die ground pad, specific to the VCSEL.

The back of a main ground bonding pad of a main chip is a whole ground plane.

A coaxial connecting device electrically connects a coaxial cable to a signal pad and a ground pad.

The integrated circuit is connected to a supply voltage via a Vcc-pad (2) and an earth pad (3).

A first interdigital electrode (41a) of the IDT electrode (41) is connected to the grounding electrode pad (29a), and the first interdigital electrode (61a) of the IDT electrode (61) is connected to the grounding electrode pad (29b).