Provided are a method of preparing a hematite platelet, a hematite platelet prepared using the method, and a hematite platelet pigment including the hematite platelet.
Forming each modified platelet does not include modifying the platelet membrane of each platelet with a glycan-modifying agent.
Each modified platelet includes a platelet and at least one polymerated chemical.
Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer.
The invention provides for the capping wafer (14) to be embodied by a glass wafer (24).
The inlet plate (6) is attached in the cartridge housing (3) while the control plate (5) is capable of sliding movement and rotation on the inlet plate (6).
The invention relates to a semiconductor chip wherein a strip conductor structure is linked with a dielectric that is capable of producing, by the introduction of ions, a conductivity that is sufficient to interconnect the conductors to give a circuit.
additional indicator maintaining small plate
sliding pinion maintaining small plate
The coupler board is between and perpendicular to the platform board attached to the housing and the splitter board attached to the lid.
With this method, adhesion of particles to the surface of a semiconductor wafer such as a silicon wafer can be reduced and local etching of a wafer can be prevented.
In another embodiment, the pad has three vias directly coupled to the pad and formed substantially beneath the pad.
A paddle member includes a handle member connected between the paddle member and the semiconductor die to suspend to paddle member in the hole.
A micromachine device is provided with a pad (107a) and a pad (107b) composed of impurity doped polysilicon.
A polymer pad is disposed on each metallic pad wherein a ratio of an exposed portion of an upper surface of the metallic pad to a top surface of the polymer pad is at least about 3.5 to 1.
The spring is configured to bias the upper pad and the lower pad towards each other.
The paddle lead assembly further includes a plurality of lead bodies coupled to the paddle body.
The first wafer is bonded to a second wafer so that a circuit on the second wafer may be electrically connected to the electronic device of the first wafer.
A wafer table for a wafer with electrical components comprises a horizontal rotary disk for placing the wafer upon and a stationary ejector for detaching the components from a carrier foil of the wafer.
The package is assembled with a plurality of cards, including a blister card (20), a backing card (30), and a trace card (40).
The cathode wafer may be bonded to one side of the cavity wafer and the anode wafer may be bonded to another side of the cavity wafer.
A resonator filter assembly is provided having a first wafer (102), a second wafer (104) and a third wafer (106).
The result is a highly uniform structure across a semiconductor wafer and from wafer to wafer.
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (107).
The wafer support and alignment apparatus includes a wafer support component adapted to seat, align and support a wafer.
The boat further comprises a wafer holder in contact with the wafer and a body part supporting the wafer holder.
A location of a wafer notch (104) on the edge of the wafer is determined.
A third wafer is placed on the upper surface of the second wafer.
The wafer (16) is demounted, and the shape of the polished wafer is determined.
The processing equipment includes a wafer support that supports a wafer in a treatment region during wafer processing.
In some implementations, the semiconductor wafer is a GaAs wafer.
While exposure is being conducted on the first wafer stage (WST1), wafer change and wafer alignment are conducted on the second wafer stage (WST2).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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