The printed circuit board preferably has an insulating plate with a cut-out (36) in the region of the resistor.

A circuit board according to this invention comprises an insulating board (2) of insulating material and an electric circuit formed of etched copper layers (3, 4) provided on the outer surfaces thereof.

The backplane includes a ground pad (50) which circumscribes the connectors and is connected to the ground plane.

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6).

A test probe ground pad (41A, 41B) is disposed on the first surface of the substrate and spaced from a portion of the via disposed on the first surface of the substrate.

The invention concerns a microelectrode designed to support at least a cell with excitable membrane, comprising an insulating wafer (11) whereon are formed detecting electrodes.

Then a gold-metallized insulating plate is welded to one side of the LD package main body and the LD bar and gold-metallized part are connected by wire bonding.