Passivates are also disclosed.

A method of fabricating a passivation layer and a passivation layer for an electronic device.

The passivation strength of the passivation layer is increased by polishing the substrate with a first voltage for a first time period.

During a passivation step, a passivation atmosphere is applied on the substrate so as to cover the first zone with doping impurities.

A first passivation layer (14) is deposited.

With this invention, a passivation film for a semiconductor substrate that has an excellent passivation effect can be formed by an easy method.

The passivation layer (18) is patterned to form a first opening (20) to contact the last interconnect layer (16).

The layer requiring contact may be multifunctional providing its own passivation, such that passivation is substantially not required in the dielectric layer.

The passivation layer (9) includes a plurality of embossments (10), and the pixel electrodes (1) are formed on the passivation layer (9).

A surface passivation apparatus is also described.

Surtec 693 black passivation and Surtec 684 (thick-layer) (are also available.

The passivation of the sanitary pipe fittings depends on the passivation process and the steel.

The process concludes with conventional passivation methods.

A passivation layer (202) overlies the upper surface.

The passivation layer is removed.