In one embodiment the copper metal powder is converted to cuprous oxide, cupric oxide or a mixture thereof which can be dissolved in sulfuric acid and used to make copper foil.
Ammonium nitrate is phase-stabilized (1) by a synergistic phase stabilization additive combination of at least cupric oxide and potassium nitrate.
The thickness of the cupric oxide is regulated to 0.6-3.0 µm.
38 % (± 10 %) of Cupric Oxide (CAS RN 1317-38-0) and
A semiconductor device (10) is provided with copper traces (16) for connecting active elements to an external device, and insulating layers of black oxide (90) (cupric oxide) are formed on the traces.
A second biocide such as zinc oxide or copper oxide can also be dispersed in the porous, hydrophilic ceramic-based coating.
The invention relates to a method for preparing stable cupric hydroxide by removing the ferrous ion from the starting cupric solution.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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