A multi-chip module (10) and a method for manufacturing the multi-chip module (10).

A multi-chip module (MCM) is described.

Embodiments of a method for assembling a multi-chip module (MCM) are described.

A multi-chip module is thus completed.

A multi chip module and a fabrication method thereof are provided.

The invention relates to a multi-chip module and a method for producing the same.

Embodiments of a multi-chip module (MCM) are described.

The aim of the invention is to provide a highly integrated multi-chip module.

In one example, a radio uses a multi-chip module, including a chip carrier (14).

The overmolded module can be an MCM and the substrate can be a laminate circuit board, for example.

A muti-chip module (MCM) assembly has three stacked integrated circuit (IC) layers.

The present invention discloses a manufacturing method for a multichip system-level packaging structure.

The multi-chip package includes a substrate (12) having one or more film based components formed thereon.

A circuit module, such as multiple chip module (13), having a first surface and a second surface is included.

Apparatuses, multi-chip modules, capacitive chips, and methods of providing capacitance to a power supply voltage in a multi-chip module are disclosed.