Provided is an error measurement and correction device of a stage of a wafer prober.
The present invention relates to a method and apparatus for controlling the Z axis position of a wafer prober.
A reference member (42) is provided to mount to the wafer prober and has an underside with a feature (44) defining a second plane.
An apparatus (69) for use with a wafer prober (15) and a probe card (34) comprising a stiffening member (60) having a feature (68) defining a first plane.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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