Printing may be provided on the hologram before metallizing.
All layers (60, 61, 62) of the turbulence disc are produced by means of electrodeposition (multilayer metallizing).
All layers (60, 61, 62) of the turbulence disc are produced by means of electrodeposition (multilayer metallizing).
All layers (60, 61, 62) of the turbulence disc are produced by means of electrodeposition (multilayer metallizing).
All layers of the atomizing disc (30) are constructed directly on top of one another by means of electrodeposition (multilayer metallizing).
An electric arc spray metalizing apparatus includes a spray gun (10) which delivers a metalizing coating to the substrate.
A method for metalizing a plastic surface is provided.
A method of metalizing the surface of a plastic substrate is provided.
Weaving combined with dyeing or with coating or with laminating or with metalizing
A hole wall metalizing process during production of ceramic shells.
The plating material output from the reaction tank is supplied to the plating system through a filter (46) so that only desired plating material is supplied to the plating system.
The selective metallization (M) is then carried out using a currentless metal deposition process which is optionally an electroplating process.
vacuum plating with metal of plastic objects
Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber.
A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
The film is used for printing, metallising or coating.
Also disclosed is a process for metallising compounds which can be bonded to a metal ion by reacting the compound with a metal ion in molten urea.
The invention relates to a method for metallising an insulating substrate by depositing a thin, uniform film of metal.
The invention relates to a method for metallising semiconductor elements in which aluminium is used.
Base metal wire and rods of agglomerated base powder, used for metal spraying (including parts
Base metal wire and rods of agglomerated base powder, used for metal spraying (including parts
Base metal wire and rods of agglomerated base powder, used for metal spraying (including parts
Base metal wire and rods of agglomerated base powder, used for metal spraying (including parts
An anticorrosive which combines the same easiness as coating with the same superior properties as metal spraying.
The metallization line is defined from a metallization level and the thin metallization film is defined before a next metallization level above the metallization level is defined.
The invention is applicable to the metallization of plastics, anti-corrosion treatment, treatment for reducing coefficient of friction and electromagnetic armouring.
Deposition of the second metallization is de-coupled from deposition of the first metallization.
The surface of the body is metallized according to an evaporation method, a flame-spraying method or by means of chemical metallization.
An upper metallization layer is then formed over the upper dielectric layer.
The second set of facets (1b) is left unmetallized.
The metal surface is metallized and activated in a single step.
The metallized structure has to be continuously stripped from the contact wheels (2).
Disclosed is a method for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process.
Instead of the conventional metallizing, there can be sprayed on flakes of highly specular metal made by breaking up a thin coating of metal metallized by conventional metallizing on a removable support.
Continuity, insulation and bonding techniques and testing
Continuity, insulation and bonding techniques and testing
Adaptive solid copper pads on multiplayer bonding regions minimize bonding errors and improve reliability.
The invention is further characterized by an improved quality of the bonded layers and an improved productivity of the bonding method.
It also allows to use novel bonding methods.
According to the invention, the stability of the metallisation is improved by a structuring of the pad metallisation in the region of the UBM metallisation.
The feedthrough connections are sealed by means of a metal coating that is disposed on the bottom side thereof.
A second electro-cladding layer (66) is disposed on the first cladding layer.
A first metallisation plane (14), a second metallisation plane (15) and contacts (16) connecting said first metallisation plane (14) to said second metallisation plane (15) are provided in a periphery (P1).
In a currentless metallisation process for non electroconductive substrates, a metallisation backing layer is applied on the substrate before its metallisation.
The component is of a second, different metallization.
The metallization ratios range from 0.2 to 0.8, and the metallization ratio of the first transducer is no more than 0.8 times the metallization ratio of the second transducer.
The second electrically conductive metallization layer is connected to the first electrically conductive metallization layer through conductive via plugs formed in the electrically insulating layer.
Vacuum-vapour plant for the deposition of metal
Vacuum-vapour plant for the deposition of metal
Vacuum-vapour plant for the deposition of metal
The connections (208) can also be established by metallisation then etching, the metallisation permitting the establishment of the connection by means of the holes.
Vacuum-vapour plant for the deposition of metal
The electrode has a metal portion of a first metallization.
The capacitor includes a metallization line with a high dielectric constant layer defined over the metallization line.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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