An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure.

A ring link assembly is configured to securely link a first component to a second component.

The ring- shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer.

This device is basically an annular link built and used as presented in the explanation.

An annular unitizing element (30) comprising a rotor engaging member (36), a stator engaging member (32), and a rear member (34).

The annular gap is fluidically connected to the pressure chamber.

The link also has an end curvature at the end having the ring bore wherein the curvature axis is substantially perpendicular to the ring bore axis.

The device includes a distal annular ring; a mesh connected to the distal annular ring; and a proximal annular ring connected to the mesh by at least two connecting portions.

A connecting portion (31) matching the strap (4) is also arranged on the sleeve ring (3).

The connection mechanism comprises an annular boss (3) and a buckle ring (4) buckled with and connected to the annular boss (3).

The position where the strap (4) connects to the sleeve ring (3) is symmetrically opposite the connecting portion (31) of the sleeve ring (3) with respect to the central line of the sleeve ring (3).

The bearing pedestal (51, 52) is located in the center of the ring-shaped cover (7) and connected with the ring-shaped cover (7) by the connecting tendons (6).

The junction (31, 38) of the annular face (30, 36) and the frusto-conical or hemi-spherical portion (28, 37) engages the junction (32) of the annular seat (22) and bore (21) of the valve seat assembly (16).

An annular cooling gallery is formed laterally between the upper and lower joining surfaces.

The first annular space is fluidly coupled to the low pressure port of a conventional diaphragm assembly and the second annular space is fluidly coupled to the atmosphere.