An adhesive bonding device (40) comprises an upper face bonding unit (41a) and a lower face bonding unit (41b).
Disclosed is an adhesive bonding sheet comprising a light-transmitting supporting base and an adhesive bonding layer which can be used in both the dicing step and the semiconductor device bonding step.
Such a rubber composition for adhesive bonding is improved in break characteristics.
The bond is achieved without the application of heat to either the connecting rod (12) or the bearings (22, 26) by adhesive bonding or magnetic pulse welding.
A magneto-active adhesive and method of adhesive bonding by magnetic field.
An adhesive bond is generated between the layers.
An adhesive layer is applied directly onto the sol-gel layer without any adhesive bond primers.
Recessed adhesive binding systems.
Provided are methods for structurally bonding adhesives to aluminum components without using adhesive bond primers.
The invention provides an adhesive bond between the tap and its supporting surface.
An adhesion bond strength enhancer for cementitious adhesive mortar is disclosed.
The reinforcing metal element comprises on its surface an adhesive tie-layer.
The electrode structure comprises an electrode for adhesive connection, which is formed on a base, and an organic film which serves as an oxidation preventing film that covers the surface of the electrode for adhesive connection.
Recessed adhesive binding systems and methods of making same.
The adhesive on the bottom layer is a natural latex forming a high adhesive bond with the bottom layer while the adhesive on the small boards forms a weaker adhesive bond to the wood.
A modified amalgam composition forming an adhesive bond with tooth structure treated with a dental adhesive.
The resinous binder is capable of formingan adhesive bon with the joint compound when set.
The glue provides a strong adhesive bond between the separator, desirably of microporous polypropylene, and the cathode.
The aim of the invention is to provide an optimized adhesive that has good adhesive properties even when the adhesive link has been repeatedly released and joined again and with a reduced migration of noxious components.
The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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