The heater unit includes a pair of heater sub-elements assembled together by means of at least one leak proof joint to form the heater unit.
A compact combined heater and pump is disclosed.
A heater, such as a susceptor for use in electronics industry manufacturing processes, and a method for manufacture of such a heater.
A heater is connected to the nozzle body.
A cord-like heater comprises a heat generating wire and a thermally bonded section which is formed on the outer periphery of the heat generating wire.
Envelope loss factor of the heat generator
Heat generator to be installed outside the heated area
A heat supply heats the working fluid and includes a first heat generator incorporating a solar collector, (21, 221, 321, 350) and a second supplemental heat generator (23, 223, 323).
A heat generator and method for generating heat is described.
Fenv are the envelope losses of the heat generator, expressed in %
The electronic apparatus has a first heat generating component, a second heat generating component disposed side by side with the first heat generating component, and the heat dissipating module.
The heat generation element (200) generates heat, and the heat dissipation member (100) dissipates to the outside heat received from the heat generation element (200).
A heat generating body and a method of producing the heat generating body.
The present invention relates to a heat-generating film and to a heat-generating product comprising same.
As the air is circulated along the surface of the water-impregnated layer, water with which the water-impregnated layer is impregnated is vaporized and the heat-generating element is cooled by the vaporization latent heat of the water.
A heat exchanger is disclosed for dissipating heat from a heat generating component.
The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component.
The heat exchanger is thermally coupled to the heat generating device.
A heatsink (10) is provided with a base body (11) opposed to a heat generating body (14) and absorbing heat from the heat generating body (14).
The heat generating electric component (9) is formed with an exhaust hole (69) for ejecting air inside the heat generating electric component (9).
The integrated thermal management system includes heat generation means (4), cooling means(5) and heat distribution means comprising heat sink (6) with heat distribution fins (7).
The heat sink (100A) transmits heat of a heat generating component (12) to a cooling fluid (CF).
A heat generating device (12) is installed in the socket (14).
The operation of the heat generating component (304) is altered to avoid an over temperature condition of the non-heat generating component (302) based upon the sensed temperature.
A thermal interface member in a heat generating, electronic device is provided.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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