To facilitate thermal dissipation, a heat sink (406) is disposed proximate to the back reflector (404).
Heat dissipation system includes an elongated radar absorbing member (22, 329, 32 b ) configured with a thermal dissipation mechanism ( 26,309,30 b ).
A heat sink can be coupled to the thermal management module to improve thermal dissipation.
The thermal dissipation layer is thermally conductive and electrically insulating.
A luminaire with enhanced thermal dissipation characteristics is disclosed.
Depending on the heat loss and the size of the enclosure, passive heat dissipation may be adequate.
The heat dissipation substrate (2) is connected to the heat dissipation housing (3) to perform heat conduction and heat dissipation.
The individual heat dissipation structure facilitates the heat dissipation and replacement.
The heat dissipation module also includes a plurality of heat dissipation fins.
Also, the heat dissipation structure provides high heat dissipation efficiency even though the heat dissipation structure is compact.
The heat dissipation system includes two upper and lower heat dissipation channels (2, 4).
The heat dissipating means enhances the convective heat dissipating on the basis of high heat conductibility and improves the effect of heat dissipating.
A removable heatsink assembly comprised of a heatsink unit (10) and a heatspreader (9) is provided.
Disclosed are a heat dissipating chassis and a heat dissipating case which are excellent in moldability, thermal conductivity, heat dissipating property and electromagnetic shielding property.
A heat dissipating air channel (330) is formed between adjacent heat dissipating fins (33).
The chip heat-dissipation structure and the liquid crystal display device using the chip heat-dissipation structure have the desirable heat-dissipation effect.
The power semiconductor module has a first heat radiation part and a second heat radiation part facing the first heat radiation part.
The fanless LED lamp includes the linear heat dissipating unit as a heat dissipating means.
The thermal barrier further comprises a heat dissipating layer.
The heat dissipating sheet (1) has a double structure wherein a first heat dissipating sheet (11) and a second heat dissipating sheet (12) are laminated in the thickness direction.
A heat dissipating device having a linear heat dissipating unit and a fanless LED lamp using the device are disclosed.
The heat dissipater (100) comprises a first heat dissipation cavity (110).
The heat-dissipating member is provided with an isolator member (14,14',14”,24) coupled on the first side (112) of the heat-dissipating member.
The LED assembly is in thermal communication with the heat dissipating base.
The heat dissipation structure of the electronic equipment adopts the foregoing electronic equipment heat dissipation structure (10).
The at least one heat dissipating element (5) is adapted for heat dissipation from the focal track (4) in the direction of reduced thermal conductivity of the anode disk element (1).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Traduction Translation Traducción Übersetzung Tradução Traduzione Traducere Vertaling Tłumaczenie Mετάφραση Oversættelse Översättning Käännös Aistriúchán Traduzzjoni Prevajanje Vertimas Tõlge Preklad Fordítás Tulkojumi Превод Překlad Prijevod 翻訳 번역 翻译 Перевод