A bare chip carrier (2) is loaded on a burn-in board of a burn-in device.
The present invention enhances the burn-in facility by providing flexability of electrical connection from various sources to burn-in mounts.
In the present invention there is provided a burn-in system for burning in one or more optoelectronic devices comprising at least one burn-in printed circuit board (PCB).
A burn-in apparatus with a radio frequency signal generator is provided.
Accordingly, heat dissipation is reduced during burn-in.
Use elementary problem solving or debugging techniques.
Nicolas for the mental debugging (though he may not know about it)
The debugger monitor is connected, preferably by a serial connection, to an external host computer (105) for controlling the debugging.
Rule of Transparency: Design for visibility to make inspection and debugging�easier.
Rule of Transparency: Design for visibility to make inspection and debugging═easier.
Knowledge of harm reduction principles and practice;
Reliability stress screening – Part 1: Repairable assemblies manufactured in lots
Reliability stress screening – Part 1: Repairable assemblies manufactured in lots
Reliability stress screening – Part 1: Repairable assemblies manufactured in lots
Reliability stress screening – Part 1: Repairable assemblies manufactured in lots
Reliability stress screening – Part 1: Repairable assemblies manufactured in lots
Classic burn-in (or "Storage in temperature") which consists in subjecting materials to a constant hot temperature during a defined period of time.
Methods of and systems for wafer level burn-in (WLBI) of semiconductor devices are also disclosed.
Systems and methods for reducing temperature dissipation during burn-in testing are described.
A method for reducing sub-threshold leakage during the burn-in procedure for a semi-conductor is disclosed.
A method of high reverse current burn-in of solar cells and a solar cell with a burned-in bypass diode are described herein.
Both cars were struggling with teething issues that usually accompany brand new cars.
The structure is useful as a probe for testing and burning in integrated circuit chips at the wafer level.
A socket is provided for burn-in testing of an integrated circuit package having electrical leads.
A socket is provided for burn-in testing of an integrated circuit package having electrical leads.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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