A study on the bendable silicon memory package using gold wire interconnections... Symmetric ????????? ?????? ????????? Rubbery??? ????????? ?????? ????????? ???????????? ???????????? ????????? Top/Bottom??? ?????? ????????? ???????????? ??????????????? ???????????? Package Body??? ??????????????? Strip ???????????? ??? ?????? ????????? ?????? ?????? ????????? Saw ???????????? ???????????? ????????? ?????? ?????? ????????? ???????????? 20mm??????...
Including non-functional issues in anna/ada programs for automatic implementation selection... Non-functional information may be considered not only as valuable comments, but also as an input for an algorithm capable of selecting the "best" package body for every package definition in a program, the "best" meaning the one that fits the set of non-functional requirements of the package in the program
Applications notes on surface mount assembly of amkor technology bga packages... In contrast, BGA packages, when attached to a printed circuit board (PCB), effectively hide the solder joints between the package body and th
