The u!trasonic bonding system includes a bond head assembiy and a bonding tool supported by the bond head assembiy.
Bonding is carried out in one or two spaced apart adhesive points (16, 17).
A bonding part (200) wherein a bonding wire is connected to a bonding pad is composed of a first connecting part (201) on a leading edge side and a second connecting part (202) continuous to the first connecting part (201).
Disclosed is a method for bonding semiconductor substrates, wherein an eutectic alloy does run off the bonding surfaces during the eutectic bonding.
The bonding adhesive includes binder resin and silver powder.
Roughing and cementing tool heads are stationarily mounted at the respective roughing and cementing locations.
joining techniques (including welding and bonding
Unsewn (perfect) binding machines for books
Unsewn (perfect) binding machines for books
Unsewn (perfect) binding machines for books
Unsewn (perfect) binding machines for books
Unsewn (perfect) binding machines for books
The size composition is prepared by mixing together the said size fraction and pigment fraction.
A size composition for the surface sizing of paper, board or other suchlike.
The invention also pertains to a laminated paper web having an oversized bonding pattern of intersecting bonding lines (1, 2)
A staining and sticking system composed of a staining device and a sticking device provided separately from the staining device, enabling further lightening of the staining and sticking work, and having a small size.
The small-sized reactors (1, 2), in which a plurality of inorganic transparent substrates (11-13) are firmly adhered together, are obtained by adhering the adhering surfaces by means of chemical bonding using oxygen.
A tape splicing mechanism which is particularly adapted for splicing leader tape to the magnetic tape of a video cassette.
A method of splicing film is also provided.
The invention is in the field of devices enabling the sticking of splicing tapes to the ends of strips put into rolls, to prevent their later unwinding.
lack of fusion due to metal being deposited on a layer of oxide which has fused but not dispersed
lack of fusion due to metal being deposited on a layer of oxide which has not been fused
A safe effective tissue closing preparation.
In an embodiment, the bonding means comprises partial transient liquid phase bonding.
open assembly time in adhesive bonding
The invention relates to a method of bonding microstructured substrates, which is intended, for example, for the production of micro-fluidic components.
The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
The invention also provides a bonding apparatus (215) for carrying out said bonding method.
A collage may be created with the collage images in the determined positions.
Optionally, includes a micro-mask adhering unit, and a macro-mask adhering method.
Unsewn (perfect) binding machines for books
A plurality of pressure-adhering units (Qu1, Qu2) having adhering heads (1, 1') are arranged in the adhering direction of the anisotropic conductive film, and the interval between the adhering heads (1, 1') is adjustably set.
A processing method of paste link and a paste link processor based on object storage library are disclosed.
I like the idea of making a collar into a necklace.
Photo Collage Maker is digital scrapbooking and photo collage software.
Planing, sanding or finger-jointing
creep limit of the bond
The layers are adhesive bonded together.
These mixtures are suitable as adhesive resins.
Planing, sanding or finger-jointing
Planing, sanding or finger-jointing
Technical development of the universal shoe toecap and stiffener protector: upper material: leather, rubber, fabric, plastic; lining material: felt, fabric, rubber, foam material; assembly: stitched, welded or adhesively secured.
These components include a clip motion which defines a sequence of states, a clip character which applies the clip motion to a particular image configuration, and clip art.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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