In the multilayer bonding method, the upper substrate can be bonded to the lower substrate without being taken out from the bonding chamber after the upper substrate is bonded to the intermediate substrate.

The above substrate allows an element to be joined to the substrate with enhanced joining strength.

Consequently, the semiconductor device is obtained by suppressing breakage of the substrate bonded to the semiconductor substrate.

The device substrate is bonded to the handle substrate and is composed of a material suitable for fabrication of optoelectronic devices.

The metallic buffer component is sealed to the substrate with a layer of solder (18).

Alternatively, the resin substrate may be bonded to the glass substrate before the formation of a principal part of the plasma display panel.

The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.

The carrier sheet (15) typically is peeled away after the circuit is adhesively bonded to the substrate (44).

The adhesive is then cooled and bonded to the substrate permitting later removal of the intermediate carrier sheet.

In one aspect, composite articles are described herein comprising a lightweight, high strength metal substrate and an abrasion resistant coating adhered to the substrate.

The coated photoconductive substrate can include a photoconductive substrate with a charge generation layer and a charge transport layer, and can also have a coating adhered to the photoconductive substrate.

The coated photoconductive substrate can include a photoconductive substrate with a charge generation layer and a charge transport layer, and can also have a coating adhered to the photoconductive substrate.

Then a coating is applied to a second side of the film after it has been bonded to the substrate.

The supply substrate (50) may be bonded to the target substrate (55) prior to the volatilizing so as to transfer the solid layer (52) to the target substrate (55).

In embodiments, the first film is adhered to the glass substrate such that the first film does not exhibit visible delamination from the glass substrate.