Said spacer elements consist of a hard-soldering film (22) which enables the hard-soldered connection to be self-created by hard solder from the hard-soldering films (22).
The grit grains can have a size in the range from 4 to 10 mm and can be applied to the links by hard soldering.
The soldering method allows the reduction of the variation of the P content in a solder bath, which leads to the improvement of soldering quality.
In another step, the solder, especially a solder foil, is placed on the elevations, and in another step, the elevations are pressed down until they are approximately at the height of the solder thereby enabling a subsequent soldering process to ensue.
An exemplary soldering process is wave soldering of printed circuit boards.
The surface of the metal layer has a soldering areas, and a grooves positioned on the outer peripheries of the soldering areas.
Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.
The base and the cap are united together through fusion junction using a brazing filler metal.
The brazing filler metal (315) molten by heating securely flows into the recessed parts (314) and cooled for fixing.
The solder rivets serve to retain the length of solder mass to the solder-bearing article.
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C or greater.
The invention also relates to a brazing composition, to a refractory gasket, and to an assembly.
The ball solder and the solder alloy used for the cream solder have a eutectic composition.
The solder bonding section (5) is composed of a first solder (6) and a second solder (7) having different characteristics.
The ball solder and the cream solder have a relationship where the liquidus temperature of the ball solder alloy is lower than the solidus temperature of the solder alloy in the cream solder.
Furthermore, since the solder bump (18) is arranged on the opening (16a) of a solder resist layer (16), the solder resist layer operates as a dam and the solder does not flow out in reflow.
Also disclosed are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free solder alloy.
thickness of filler metal in a brazed joint
Also disclosed are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free solder alloy.
The ball solder and the cream solder are bonded by a reflow method.
The solder material (18) is prepared in deposit chambers, connected to the solder gaps (147j).
The assembly (400) uses no solder.
A brazing composition (3) as defined above, a brazing paste or suspension comprising a powder of said brazing composition and an organic binder are also defined.
By reducing the formation of solder dross, which forms when molten solder gets bound up with tin oxide, this increases the solder utilization rate.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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