A multi-chip package with signal line compression for testing of the multi-chip package.

The electrical socket (20) is independent of the multichip module (56) and permits removal and replacement of the multichip module (56) without damaging the module and its module electrical leads (58).

The multi-die package may be fashioned without the lower die or the substrate.

The multi-chip package includes an interposer and two or more integrated circuits attached to the interposer.

A test-communication path is provided between chips in a multi-chip package.

An enhanced multi chip package (eMCP) is provided including a unified memory controller.

Also, multipackage modules include at least one such multichip leadframe package.

A semiconductor device has an MCP (multiple-chip package) structure in which a plurality of semiconductor chips are arranged in the same package.

The present invention provides a method, system and structure for maintaining light characteristics from a multi-chip LED package (102).

The light source module (560) comprises the multi-chip package structure (100) composed of multiple light emitting chips (104).

A semiconductor device and its manufacturing method for miniaturizing a multichip module comprising an interposer board.

An illumination system (500) and a method of manufacturing a multi-chip package structure (100) for light emitting diodes are provided.

Therefore, a small-sized multichip module using a light emitting element which emits a large quantity of light can be obtained.

The auto-calibration circuit may also calibrate a plurality of analog input devices on an integrated circuit die or in a multi-chip package (MCP).

An electrical socket (20) used for interconnecting a multichip module (56) to a printed circuit board (50) or similar electrical system.