In one embodiment, the taper is a linear taper.
The integrated circuit chip is then thinned.
Application for image sensors on thinned silicon.
The coupler includes an adiabatically tapered optical device.
A downsized and thinned imaging device.
With such structure, the element mounting substrate is thinned, and the circuit device using such substrate is also thinned.
The invention relates to the production of electronic components on a thinned semiconductor substrate.
The electrode that is deposited has a tailored, tapered edge.
The invention relates to image sensors produced on a thin silicon substrate.
The semiconductor substrate is thinned from the first thickness to a second thickness.
Thus, the overall actuator can be thinned without increasing the size of the magnet.
The connector (30) has a second groove (32) and a tapered section (34).
This structure allows the vibrating linear actuator to be slimmed down and operate efficiently.
Also provided is a resist pattern microfined by this method.
Photogates (Fig. 11) are formed with a thinned polysilicon covering.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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